IPACK2020-2547 High Performance Computing Package With Chip Module on Substrate Solutions

von Chen, Ching Chia
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

Data Centers, Servers of the Future, Edge and Cloud Computing IPACK2021-66660 Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application

von Zhuang, Ming-Han
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

IPACK2020-2528 Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

von Hung, Chu-Pao (Otis)
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IMECE2019-10563 Advanced Packaging Solution for High Density FCCSP Molding Warpage

von Liu, Shuai-Lin
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2019 : Salt Lake City, Utah) Proceedings of the ASME International Mechanical Engineering Congress and Exposition - 2019 ; Volume 2, B (2020)

IPACK2019-6354 Double Side System in Package Development Challenge for Heterogeneous Integration

von Kao, Feng
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2022-97175 RoHS - Compliant Indirectly Material Evaluation for Manufacturing Study

von Liu, Fenny
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

IMECE2019-11181 Packaging Challenges of Thin High Bandwidth POP

von Tung, Fletcher (Cheng-Piao)
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2019 : Salt Lake City, Utah) Proceedings of the ASME International Mechanical Engineering Congress and Exposition - 2019 ; Volume 10: Micro- and nano-systems engineering and packaging (2020)

IPACK2020-2507 Material Impact With Package Solution for 5G RF Application

von Su, Po Yuan (James)
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)