Through Co-Design to Optimize Power Delivery Distribution System Using Embedded Discrete Decoupling Capacitor

von Wang, Chen-Chao
Veröffentlicht in 2010 IEEE CPMT Symposium Japan (2010)

Optimizing FCCSP Design with Cu-pillar Bump in High Sensitivity Fingerprint Sensor

von Huang, Chih-Yi
Veröffentlicht in 2014 IEEE CPMT Symposium Japan (ICSJ 2014) (2014)

High Bandwidth Application with Wide I/O Memory on 2.5DIC Silicon Interposer

von Wang, Chen-Chao
Veröffentlicht in 2013 IEEE CPMT Symposium Japan (formerly VLSI Packaging Workshop of Japan) (2013)