Strategies for Responding to the Reliability Challenges of Future Smart Systems

von Rzepka, Sven
Veröffentlicht in International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components (8. : 2014 : Wien) Smart Systems Integration 2014 (2019)

IPACK2021-73456 Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

von Vandevelde, Bart
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

Eurosime special section package and solder joint reliability analysed by fem simulation and experiments : [... papers presented at the International Conference on Thermal and Me...

Veröffentlicht 2004

LOW TEMPERATURE TECHNOLOGIES AND ARCHITECTURE FOR EXTREME ENVIRONMENTS

von Urbina, Diego A.
Veröffentlicht in IAF Space Systems Symposium (2019 : Washington, DC) IAF Space Systems Symposium 2019 (2020)