IPACK2019-6354 Double Side System in Package Development Challenge for Heterogeneous Integration

von Kao, Feng
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IMECE2019-11181 Packaging Challenges of Thin High Bandwidth POP

von Tung, Fletcher (Cheng-Piao)
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2019 : Salt Lake City, Utah) Proceedings of the ASME International Mechanical Engineering Congress and Exposition - 2019 ; Volume 10: Micro- and nano-systems engineering and packaging (2020)