Robust Cu Dual-Damascene Interconnect Technology Using High-Diffusive Dopant from Cu-Alloy Seed Layer

von Tonegawa, T.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (68 : 2005 : Kyōto) Handōtai, Shuseki-Kairo-Gijutsu-68.-Shinpojiumu-kōen-ronbunshū (2005)