Analysis of Micro Structure and the Resistivity of Cu / Ni Thin Coat as a Low Temperature Sensor Using Electroplating Method Assisted with Magnetic Field outside of the Ion Flow

von Santi, W. N.
Veröffentlicht in International Symposium on Materials Science and Engineering (3. : 2020 : Seoul) Advanced material and structures (2021)

The Effect of Deposition Time on the Voltage Range and Sensitivity of Cu/Ni as Low-Temperature Sensor Resulted from Electroplating Assisted by a Transverse Magnetic Field

von Toifur, M.
Veröffentlicht in International Conference on Magnetism and its Application (2019 : Surakarta) Magnetism and its application (2020)