Endurance Properties of Adhesive Joint Against Cycling of Dry-Heat-Watering under Tensile Stress

von YAMAGUCHI, Y.
Veröffentlicht in Setchaku Kenkyū Happyōkai (14. : 1976 : Osaka) Dai 14kai Setchaku Kenkyū Happyōkai (1976)

Photo-enhanced Electrochemical Mechanical Polishing for Cu Damascene

von Yano, H.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (66 : 2004 : Tokio) Handōtai, Shuseki-Kairo-Gijutsu-66.-Shinpojiumu-kōen-ronbunshū (2004)

Application of Bevel Polishing to Defect Reduction in FEOL Process Flow

von Fukushima, D.
Veröffentlicht in Handōtai, Shuseki-Kairo-Gijutsu-71.-Shinpojiumu-kōen-ronbunshū (2007)

Development of Resist Planarization Process for Cu/Low-k Dual Damascene

von Shigeta, A.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (68 : 2005 : Kyōto) Handōtai, Shuseki-Kairo-Gijutsu-68.-Shinpojiumu-kōen-ronbunshū (2005)