IPACK2021-69723 Design and Application of Innovative 3DVC in Al Server System

von Tan, Xianguang
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)