Fundamental and Application of Fine Plating on ULSI Interconnection Technology

von Osaka, T.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (56 : 1999 : Osaka) 56.-Handōtai-Shuseki-Kairo-Gijutsu-Shinpojiumu-kōen-ronbunshū (1999)

Fabrication of Ni Nanostructure on Silicon Wafer by Electroless Deposition

von Niwa, D.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (60 : 2001 : Osaka) Handōtai, Shuseki-Kairo-Gijutsu-60.-Shinpojiumu-kōen-ronbunshū (2001)

Stochastic Multiscale Computational Framework for Fibrous Composites Considering many Physical and Geometrical Random Parameters

von Takano, N.
Veröffentlicht in European Conference on Composite Materials (18. : 2018 : Athen) 18th European Conference on Composite Materials (ECCM-18) ; Volume 3 of 8 (2020)