Reliability of Plastic Molded ICs using Copper Wire Ball Bonding

von TSURUMARU, Kazuhiro
Veröffentlicht in International Symposium on Reliability and Maintainability (20 : 1990 : Tokio) International Symposium on Reliability and Maintainability, 1990-Tokyo (1990)

38.3 A speaker verification using CELP parameters under noisy conditions

von Fujita, Yusuke
Veröffentlicht in Symposium on Information Theory and Its Applications (27 : 2004 : Gero, Gifu-ken) 27.-Jōhō-Riron-to-Sono-Ōyō-Shinpojiumu ; Vol. 2 (2004)