HT2020-8987 Experimental Investigation of Shell-Side Flow Condensation on Three-Dimensional Enhanced Surface Tubes

von Yang, Desong
Veröffentlicht in ASME Summer Heat Transfer Conference (2020 : Online) Proceedings of the ASME Summer Heat Transfer Conference - 2020 (2020)

FEDSM2020-20094 Visualization of R410A Flowing in Copper and Stainless Steel Dimpled Tubes Enhanced by Petal-Shaped Patterns Under Evaporation Conditions

von Tang, Weiyu
Veröffentlicht in American Society of Mechanical Engineers (2020 : Online) Proceedings of the ASME Fluids Engineering Division Summer Meeting - 2020 ; Volume 1: Fluid applications and systems, fluid measurement and instrumentation (2020)

MNHMT2019-4042 Numerical Investigation of Flow Boiling in a Manifold Microchannel Heat Sink With Conjugate Heat Transfer

von Sun, Zhichuan
Veröffentlicht in ASME International Conference on Micro/Nanoscale Heat and Mass Transfer (6. : 2019 : Dalian) Proceedings of the ASME 6th International Conference on Micro/Nanoscale Heat and Mass Transfer - 2019 (2019)

MNHMT2019-4038 Evaluation of Existing Frictional Pressure Drop Correlations During Condensation of R410A in Four Horizontal Tubes

von Shen, Kunrong
Veröffentlicht in ASME International Conference on Micro/Nanoscale Heat and Mass Transfer (6. : 2019 : Dalian) Proceedings of the ASME 6th International Conference on Micro/Nanoscale Heat and Mass Transfer - 2019 (2019)

IPACK2018-8449 Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes

von Shen, Kunrong
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2018-8454 Experimental Study on Flow Evaporation Heat Transfer Characteristics Inside Horizontal Three-Dimensional Enhanced Tubes

von Li, Wei
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)