Wide bandgap power semiconductor packaging : materials, components, and reliability

Veröffentlicht 2018

Lead-free soldering in electronics : science, technology and environmental impact

Veröffentlicht 2004

Fatigue and Creep Properties of Sintered Ag Paste from Room Temperature to High Temperature

von Chen, Chuantong
Veröffentlicht in TMS Annual Meeting & Exhibition (149. : 2020 : San Diego, Calif.) TMS 2020 149th Annual Meeting & Exhibition supplemental proceedings ; Volume 1 (2020)

Highly Heat-resistant Bio-based Nanofiber Substrate for Flexible Electronics

von Hsieh, Ming-chun
Veröffentlicht in 2014 IEEE CPMT Symposium Japan (ICSJ 2014) (2014)

Bonding and High-Temperature Storage Performance of Die Attachment with Ag Paste Sintering on Bare Direct Bonding Aluminum (DBA) Substrate

von Zhang, Zheng
Veröffentlicht in TMS Annual Meeting & Exhibition (149. : 2020 : San Diego, Calif.) TMS 2020 149th Annual Meeting & Exhibition supplemental proceedings ; Volume 1 (2020)

Reliability Evaluation of Ag Sinter-Joining Die Attach Under a Harsh Thermal Cycling Test

von Zhang, Zheng
Veröffentlicht in TMS Annual Meeting & Exhibition (150. : 2021 : Online) TMS 2021 150th Annual Meeting & Exhibition supplemental proceedings (2021)

Effects of the Crystallographic Orientation of Sn Grain During Electromigration Test

von Lee, Kiju
Veröffentlicht in 2010 IEEE CPMT Symposium Japan (2010)

Effects of additional Ni and Co on microstructural evolution in Sn-Ag-Bi-In solder under current stressing

von Kim, Youngseok
Veröffentlicht in 2012 2nd IEEE CPMT Symposium Japan (2012)

SUB 851: Microstructure of Weak-Micro-Via and its Failure Prevention

von Hsieh, Ming-Chun
Veröffentlicht in SMTA International Conference (2021 : Minneapolis, Minn.; Online) 2021 SMTA International Conference ; Volume 2 of 2 (2022)