IPACK2022-97423 Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate

von Bhandari, Rabin
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

Mechanical Failure of Thermal Interface Materials Due to Thermal Aging and Impact on Performance of Electronic Package

von Chauhan, Tushar
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)

IPACK2022-97494 Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

von Simon, Vibin Shalom
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

IPACK2022-97402 CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server

von Murthy, Prajwal
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

IPACK2022-97429 Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

von Sivaraju, Krishna Bhavana
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)