IPACK2019-6325 A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

von Shu, Weicheng
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2018-8210 Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

von Wu, Ruikang
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)