Thermal and Electric Conductive Analysis in Isotropical Conductive Adhesive by Modeling 3D Fillers Dispersion Observed by FIB-SEM

von Arao, Osamu
Veröffentlicht in 2012 2nd IEEE CPMT Symposium Japan (2012)

Analysis on Adhesive Mechanism of Non Electrolytic Ni—Plating

von NAGASAKA, Shinsuke
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-45.-nenji-taikai (2007)