Application of Low Temperature and Low Hydrogen Process to MRAM and FeRAM by using Pseudo Remote Plasma Chemical Vapor Deposition

von Shimazu, T.
Veröffentlicht in Handōtai, Shuseki-Kairo-Gijutsu-71.-Shinpojiumu-kōen-ronbunshū (2007)

LIGHT OUTPUT CHARACTERISTIC OF INORGANIC SCINTILLATORS TO INTERMEDIATE-ENERGY CHARGED PARTICLES

von Koba, Y.
Veröffentlicht in Radiation detectors and their uses (2007)

Preferred Grain Orientation to Enhance Interdiffusion at Room Temperature in Atomic Diffusion Bonding: A Fundamental Study Using Ni and Cu Films

von Uomoto, M.
Veröffentlicht in International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17 (2023)

Crystal Lattice Rearrangement Occurred at Au/Ag Bonded Interface in Atomic Diffusion Bonding in Vacuum

von Goto, F.
Veröffentlicht in International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17 (2023)

Blade Test in Atmospheric-Pressure Ar Gas to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding

von Iemura, H.
Veröffentlicht in International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17 (2023)

Atomic Diffusion Bonding in Air Using Oxide Films

von Shimatsu, T.
Veröffentlicht in International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17 (2023)