IPACK2021-73015 Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

von Arrivo, Lucas
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

Mindful activism : autoethnographies of social justice communication for campus and community transformation

von Tillmann, Lisa M.
Veröffentlicht 2022