IPACK2021-73954 Optimizing Closed-Loop Liquid Cooling Solution for Extreme High Power Multi-Packages

von Sahan,, Arunima Panigrahy, Prabhakar Subrahmanyam, Ying-Feng Pang, Ridvan
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)