IPACK2022-97449 Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

IPACK2021-74069 Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

IPACK2020-2659 High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

von Lall, Pradeep
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)