IPACK2022-97218 Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

von Min, Daeho
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)