200 mm Ge Wafer Production for Oxide-Free Si-Ge Direct Wafer Bonding

von Rebhan, B.
Veröffentlicht in Pacific Rim Meeting on Electrochemical and Solid State Science (2020 : Online) (16.) Semiconductor Wafer Bonding: Science, Technology and Applications 16 (2020)

Direct Wafer Bonding Methods: A Practical Process Selection Guide

von Dragoi, V.
Veröffentlicht in Pacific Rim Meeting on Electrochemical and Solid State Science (2020 : Online) (16.) Semiconductor Wafer Bonding: Science, Technology and Applications 16 (2020)

Surface Activated Si-Si Wafer Bonding Using Different lon Species

von Danner, M.
Veröffentlicht in International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17 (2023)

Oxide-Free SiC-SiC Direct Wafer Bonding and Its Characterization

von Kerepesi, P.
Veröffentlicht in International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17 (2023)

Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration

von Wernicke, T.
Veröffentlicht in International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17 (2023)