IPACK2019-6568 Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB's and Reliability of Electronic Packages

von Ramdas, Shrinath
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)