IPACK2022-97729 Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling

von Cataldo, Filippo
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)

IPACK2021-73271 Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model

von Khalid, Rehan
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

IPACK2021-73270 Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Condenser Model

von Khalid, Rehan
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

IPACK2021-73269 Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Evaporator Model

von Khalid, Rehan
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

Il NeXt Impact® come strumento per rendere il PNRR un piano impact based

von Becchetti, Leonardo
Veröffentlicht in Rassegna economica (2022)

Come cambiare l'economia : strumenti di rendicontazione, progettazione e valutazione multidimensionali e partecipati

Veröffentlicht 2020