iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes - Part VII: Mechanical Shock Test and Failure Analysis on Mixed SnAgCu-BiSn Solder Joints of FCBGA...

von Radhakrishnan, Jagadeesh
Veröffentlicht in SMTA International Conference (2020 : Online) SMTA International Conference 2020 (2021)