Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding

von Nagano, F.
Veröffentlicht in Pacific Rim Meeting on Electrochemical and Solid State Science (2020 : Online) (16.) Semiconductor Wafer Bonding: Science, Technology and Applications 16 (2020)

TSV-ASSISTED HYBRID FINFET CMOS - SILICON PHOTONICS TECHNOLOGY FOR HIGH DENSITY OPTICAL I/O

von Guermandi, D.
Veröffentlicht in ECOC (45. : 2019 : Dublin) 45th European Conference and Exhibition on Optical Communication (ECOC 2019) ; Volume 2 of 2 (2021)