IPACK2019-6307 Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings

von Pham, Quang N.
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2020-2613 Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

von Quach, Nhi V.
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)