A Case Study: The Influence of QFN Package Construction on Solder Joint Durability

von Pearson, Tim
Veröffentlicht in SMTA International Conference (2020 : Online) SMTA International Conference 2020 (2021)

Solder Joint Integrity Evaluation of Bottom Terminated Component (BTC) Subjected to Thermal Cycling

von Pearson, Tim
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)

SLIR 753: Pb-Free Solders and Aerospace/Defense (A&D) High Performance Considerations

von Rafanelli, Anthony
Veröffentlicht in SMTA International Conference (2021 : Minneapolis, Minn.; Online) 2021 SMTA International Conference ; Volume 2 of 2 (2022)

Qualification of High Density Connector Solutions for Military and Avionic Environments

von Cho, Kimera
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)

Bottom Terminated Component (BTC) Void Concerns: Real and Imagine Aerospace

von Hillman, David
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)

SLIR 754: An Investigation on the Influence of Nickel Contamination of Plated Through Hole (PTH) Solder Joint Integrity

von Hillman, David
Veröffentlicht in SMTA International Conference (2021 : Minneapolis, Minn.; Online) 2021 SMTA International Conference ; Volume 2 of 2 (2022)