Correlation Between Cu Orientation and Pd Deposition

von Yasuda, S.
Veröffentlicht in Handōtai, Shuseki-Kairo-Gijutsu-71.-Shinpojiumu-kōen-ronbunshū (2007)

Cu Electroplating for Through Silicon Via

von Fukunaga, A.
Veröffentlicht in Handōtai, Shuseki-Kairo-Gijutsu-72.-Shinpojiumu-kōen-ronbunshū (2008)

Increase of Cu line resistance caused by Pd activation in electroless CoWP plating

von Wang, X.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (69 : 2005 : Tokio) Handōtai, Shuseki-Kairo-Gijutsu-69.-Shinpojiumu-kōen-ronbunshū (2005)