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4von Kisitu, Deogratius
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)UnknownFormat -
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9von Mingote, Victoria
Veröffentlicht in INTERSPEECH (21. : 2020 : Online) Cognitive intelligence for speech processing ; Volume 6 of 7 (2020)UnknownFormat -
10von Mingote, Victoria
Veröffentlicht in INTERSPEECH (22. : 2021 : Brünn; Online) 22nd Annual Conference of the International Speech Communication Association (INTERSPEECH 2021) ; Volume 1 of 6 (2021)UnknownFormat -
11von Prieto, Santi
Veröffentlicht in INTERSPEECH (21. : 2020 : Online) Cognitive intelligence for speech processing ; Volume 3 of 7 (2020)UnknownFormat -
12von Kisitu, Deogratius
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)UnknownFormat -
13von Gimeno, Pablo
Veröffentlicht in INTERSPEECH (21. : 2020 : Online) Cognitive intelligence for speech processing ; Volume 5 of 7 (2020)UnknownFormat -
14Veröffentlicht 1994UnknownFormat
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15von Ortega, Alfonso
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)UnknownFormat -
16von Heydari, Ali
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)UnknownFormat -
17Veröffentlicht 1994UnknownFormat
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18Veröffentlicht 1995UnknownFormat
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19Veröffentlicht 1994UnknownFormat
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