Perspective for Advanced Micro-solder Bump Bonding

von Orii, Yasumitsu
Veröffentlicht in 2013 IEEE CPMT Symposium Japan (formerly VLSI Packaging Workshop of Japan) (2013)

(Invited) Challenges of 3D-IC in the Era of Big Data

von Orii, Yasumitsu
Veröffentlicht in 2012 2nd IEEE CPMT Symposium Japan (2012)

Joint Reliability Study of Solder Capped Metal Pillar Bump Interconnections on an Organic Substrate

von Toriyama, Kazushige
Veröffentlicht in 2012 2nd IEEE CPMT Symposium Japan (2012)

Effect of preformed Cu-Sn IMC Layer on Electromigration Reliability of Solder Capped Cu Pillar Bump Interconnection on an organic substrate

von Orii, Yasumitsu
Veröffentlicht in 2012 2nd IEEE CPMT Symposium Japan (2012)

Thermal Stress and Die-Warpage Analyses of 3D Die Stacks on Organic Substrates

von Kohara, Sayuri
Veröffentlicht in 2012 2nd IEEE CPMT Symposium Japan (2012)

ICEP-IAAC 2012 : International Conference on Electronics Packaging - IMAPS All Asia Conference ; April 17 - 20, 2012, Tokyo, Japan

Veröffentlicht 2012

Thermal Stress Analysis of the 3D Die Stacks with Low-Volume Interconnections

von Kohara, Sayuri
Veröffentlicht in 2010 IEEE CPMT Symposium Japan (2010)