Integrity of Copper Diffusion Barrier Metal

von Komai, N.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (59 : 2000 : Tokio) Handōtai, Shuseki-Kairo-Gijutsu-59.-Shinpojiumu-kōen-ronbunshū (2000)

Integration Study and Electric Characteristics of the Metal Capping Cu Metalization Prepared by Electro-less CoWP Deposition

von Horikoshi, H.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (61 : 2001 : Tokio) Handōtai, Shuseki-Kairo-Gijutsu-61.-Shinpojiumu-kōen-ronbunshū (2001)

Integration of Cu/low-k Dual-Damascene Interconnects with a Porous PAE/SiOC Hybrid Structure for 65nm-node High Performance eDRAM

von Kanamura, R.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (66 : 2004 : Tokio) Handōtai, Shuseki-Kairo-Gijutsu-66.-Shinpojiumu-kōen-ronbunshū (2004)