Novel Approach to Characterization of the Strength and Toughness Degradation Due to Water Absorption for Bonded Joints Using Epoxy Adhesives

von SUZUKI, Taichi
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-39.-nenji-taikai (2001)

Effect of Fillets on the Tensile Strength of Adhesively Bondedjoints

von FUJII, Toru
Veröffentlicht in 38.-Nihon-Setchaku-Gakkai-nenji-taikai-kōen-yōshishū (2000)

Effect of Tensile Speed on Mode I Fracture Toughness of Bonded Joint Using Epoxy Adhesive

von IMAI, Katsuya
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-40.-nenji-taikai (2002)

Static and Fatigue Crack Propagation of Epoxy Adhesives under Mixed Mode Loading

von OKUBO, Kazuya
Veröffentlicht in Kōen-yōshishū, sōritsu-35-shūnen-kinen, Dai-37-kai-nenji-taikai (1999)

Fatigue Crack Propagation of Epoxy Adhesives under Mode I Loading -The Governing Factors of the Failure Mode Change

von IMAI, Katusya
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-39.-nenji-taikai (2001)

Study on How to Prevent Photosensitive Micro Material from Delaminating Brittlely by CNT Thin Film

von JOKO, Keigo
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-43.-nenji-taikai (2005)

Development of Small Piece Sparation System for Themal Sensitive Adhesives at Non-tacky State

von INAGAKI, Hironori
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-40.-nenji-taikai (2002)

Most Effective Geometries in Different Separation Systems of Small Piece for Thermal Sensitive Adhesive at Non-Tacky State

von INAGAKI, Hironori
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-41.-nenji-taikai (2003)

Study on How to Remove Thermal Sensitive Adhesive Tape from Thin Silicon Wafer

von KITAO, Naoyuki
Veröffentlicht in Kōen-yōshishū, soritsu-40-shūnen-kinen, Nihon-Setchaku-Gakkai-42.-nenji-taikai (2004)

The Effects of Water on Fatigue Crack Propagation of Adhesively Joints

von SAITO, Makoto
Veröffentlicht in 38.-Nihon-Setchaku-Gakkai-nenji-taikai-kōen-yōshishū (2000)