Finite Element Stress Response Analysis of Stepped-Lap Bonded Joints Subjected to Impact Tensile Load

von SAWA, Toshiyuki
Veröffentlicht in 38.-Nihon-Setchaku-Gakkai-nenji-taikai-kōen-yōshishū (2000)

Finite Element Stress Responce Analysis of Stepped-Bonded Joints Subjectes to Impact Tensile Load

von SAWA, Toshiyuki
Veröffentlicht in Kōen-yōshishū, sōritsu-35-shūnen-kinen, Dai-37-kai-nenji-taikai (1999)

Three-Dimensional Finite Element Stress Response Analysis of Double-Lap Bonded Joints Subjected to Impact Tensile Load

von KIDO, Shoichi
Veröffentlicht in Kōen-yōshishū, Nihon-Setchaku-Gakkai-39.-nenji-taikai (2001)

Prognostic health monitoring method for printed circuit boards subjected to random cyclic loads

von Hirohata, Kenji
Veröffentlicht in 2012 2nd IEEE CPMT Symposium Japan (2012)

IPACK2020-2556 Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

von Kato, Mitsuaki
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

Health Monitoring Method for Load Assessment in Reliability Design of Printed Circuit Board

von Hirohata, Kenji
Veröffentlicht in 2010 IEEE CPMT Symposium Japan (2010)

IMECE2019-10558 Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model

von Kato, Mitsuaki
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2019 : Salt Lake City, Utah) Proceedings of the ASME International Mechanical Engineering Congress and Exposition - 2019 ; Volume 10: Micro- and nano-systems engineering and packaging (2020)