Predicting microstructure of mixed solder alloy systems

Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

Reworking solder alloy mixtures of lead-free and tin-lead alloys

Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

The influence of thermal cycling on the adhesion of conformal coatings

von Tomlins, P.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2000)

Thermal cycling and the adhesion of glob-tops

von Nottay, J.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2000)

A test methodology for assessing lead-free joint reliability

von Dusek, M.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2000)

Creep properties of SnAgCi solder in surface mount assemblies

von Nottay, J.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

A review of mechanical test method standards for lead-free solders

von Wickham, M.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

Compatibility of lead-free solders with pcb materials

von Dusek, M.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2001)

The use of shear testing and thermal cycling for assessment of solder joint reliability

von Dusek, M.
Veröffentlicht in National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD (2000)