Multilevel Interconnection Technology using Air-Gap Structures

von Noguchi, J.
Veröffentlicht in Handōtai, Shuseki-Kairo-Gijutsu-71.-Shinpojiumu-kōen-ronbunshū (2007)

Proceedings of the 10th Symposium on Peptide Chemistry, Sapporo, Japan, September 26 - 27, 1972

Veröffentlicht 1973

Influence of CMP Process on Defects in SiOC Films and TDDB Reliability

von Yamada, Y.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (69 : 2005 : Tokio) Handōtai, Shuseki-Kairo-Gijutsu-69.-Shinpojiumu-kōen-ronbunshū (2005)

Electrochemical Corrosion of Copper Damascene Interconnection Process

von Homma, Y.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (58 : 2000 : Tokio) 58.-Handōtai-Shuseki-Kairo-Gijutsu-Shinpojiumu-kōen-ronbunshū (2000)

Process Design for Dual-Damascene Copper Interconnects with High Reliability

von Oshima, T.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (60 : 2001 : Osaka) Handōtai, Shuseki-Kairo-Gijutsu-60.-Shinpojiumu-kōen-ronbunshū (2001)