Technical feasibiliy [!] study of the neutrino beam at KEK

Veröffentlicht 1993

Opening adress

von Nishikawa, N.
Veröffentlicht in Neutrino Workshop (2001 : Tsukuba) Nihon-ni-okeru-seidai-no-chōkisen-nyūtorino-shindō-jikken-(JHF-SK-nü-jikken) (2001)

Effect of the Thickness of Core Materials on 180° Peeling Strength of Al/Adhesive/Core Material/Adhesive/Al Laminates

von FUKUI, O.
Veröffentlicht in Setchaku Kenkyū Happyōkai (14. : 1976 : Osaka) Dai 14kai Setchaku Kenkyū Happyōkai (1976)

A corrective assembly method using a buffer in a high-precision machining-assembly production system

Veröffentlicht in International journal of production research (2011)

A highly reliable Cu/VLK(k<2.3) multilevel interconnects for SoC technologies on 65nm node and beyond

von Sugiura, I.
Veröffentlicht in Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (65 : 2003 : Tokio) Handōtai, Shuseki-Kairo-Gijutsu-65.-Shinpojiumu-kōen-ronbunshū (2003)