Application of Nanoprobing on Subtle Defects in the Embedded Non-Volatile DDI Memory Device

von Chen, C. Q.
Veröffentlicht in International Symposium for Testing and Failure Analysis (45. : 2019 : Portland, Or.) ISTFA 2019 (2019)

Failure Analysis on Inter Polysilicon Oxide Reliability Issues of 40nm Automotive NVM Device

von Tan, P. K.
Veröffentlicht in International Symposium for Testing and Failure Analysis (45. : 2019 : Portland, Or.) ISTFA 2019 (2019)