IMECE2020-23441 Microtexture Dependence of Mechanical and Electrical Properties of Gold Thin Films Used for Micro Bumps of 3D Stacking Structures

von Nakauchi, Genta
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2020 : Online) Proceedings of the ASME International Mechanical Engineering Congress and Exposition - 2020 ; Volume 13: Micro- and nanosystems engineering and packaging (2020)

IMECE2019-11106 Measurement of the Residual Stress Distribution in the 3D-Stacked Electronic Modules by Embedded Strain Sensors

von Mizuno, Ryota
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2019 : Salt Lake City, Utah) Proceedings of the ASME International Mechanical Engineering Congress and Exposition - 2019 ; Volume 10: Micro- and nano-systems engineering and packaging (2020)