IPACK2020-2694 Deformation Behavior of SAC305 Solder Joints With Multiple Grains

von Mondal, Debabrata
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020 (2020)

IMECE2019-11630 Miniature Hemispherical Bowl-Shaped Forming Using SLA Punch and Die: Modeling and Experimental Analysis

von Mondal, Debabrata
Veröffentlicht in ASME International Mechanical Engineering Congress and Exposition (2019 : Salt Lake City, Utah) Proceedings of the ASME International Mechanical Engineering Congress and Exposition - 2019 ; Volume 2, A (2020)