IPACK2019-6568 Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB's and Reliability of Electronic Packages

von Ramdas, Shrinath
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

Solder Joint Reliability of BGA Packages on High Frequency Laminate PCBs Under Power Cycling

von Lakshminarayana, Akshay
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)

Mechanical Failure of Thermal Interface Materials Due to Thermal Aging and Impact on Performance of Electronic Package

von Chauhan, Tushar
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)