IPACK2018-8392 Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn

von Gutierrez, Erick
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2019-6470 Thermal Assessment and In-Situ Monitoring of Insulated Gate Bipolar Transistors in Power Electronic Modules

von Gutierrez, Erick
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2018-8338 Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

von Serebreni, Maxim
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

MULTI-PHYSICS BASED ANALYSIS AND DESIGN OF STATOR COIL IN HIGH POWER DENSITY PMSM FOR AIRCRAFT PROPULSION APPLICATIONS

von Bobba, Dheeraj
Veröffentlicht in AIAA Propulsion and Energy Forum (2021 : Online) Electric aircraft technology (2021)

IPACK2019-6559 Advanced Packaging and Thermal Management of High-Power DC-DC Converters

von Yuruker, Sevket U.
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)