IPACK2021-73334 Contact Angle Tuning of Copper Microporous Structures

von Soroush, Farid
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

IPACK2021-73309 A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling

von Soroush, Farid
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)