IPACK2021-74015 Lightweight, Cost-Effective Power Modules Using Polymer Baseplates With Integrated Microconvective Cooling

von Earley, David
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

IPACK2021-74016 Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

von May, Chris
Veröffentlicht in ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) (2021)

IPACK2018-8468 Practical Concerns for Adoption of Microjet Cooling

von Walsh, Stephen M.
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)