ATreatise on the insects most prevalent on fruit trees and garden produce, giving an account of the different states they pass through

von Major, Joshua

IPACK2018-8262 A Review of Degradation Behavior and Modeling of Capacitors

von Gupta, Anunay
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2019-6456 Degradation Modeling and Reliability Assessment of Capacitors

von Gupta, Anunay
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2018-8276 Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

von Paret, Paul
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2022-97283 Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

von Moreno, Gilberto
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022) (2022)