LED packaging for lighting applications : design, manufacturing and testing

von Liu, Sheng
Veröffentlicht 2011

LED packaging for lighting applications : design, manufacturing and testing

von Liu, Sheng
Veröffentlicht 2011

Experimental Research on Compressive properties of Concrete-filled RPC Tube under Axial Load

von Shan, Bo
Veröffentlicht in International Conference on UHPC Materials and Structures (1. : 2016 : Changsha) 1st International Conference on UHPC Materials and Structures (2019)

IPACK2019-6325 A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

von Shu, Weicheng
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

Freeform optics for LED packages and applications

Veröffentlicht 2017

IPACK2018-8315 Molecular Dynamics Simulation of AIN Deposition: Effect of N:AI Flux Ratio

von Zhang, Libin
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2018-8210 Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

von Wu, Ruikang
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2018-8211 Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

von Yu, Xingjian
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2018-8301 Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs Silica-on-Chip Structure

von Xie, Bin
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)

IPACK2018-8225 All-Inorganic Multi-Color Converter Based on Eu+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

von Peng, Yang
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)