gong hui shi yong ci dian

von zheng wen chuan
Veröffentlicht 199109

IPACK2019-6393 Evaluation of a Lead Glass for Encapsulating High-Temperature Power Modules for Aerospace Application

von Liu, Lanbing
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019 (2020)

IPACK2018-8276 Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

von Paret, Paul
Veröffentlicht in ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018 (2019)