Effects of Soil Fabric on the Thermal Expansion Coefficient of Clay with Reference to the Crack Formation in Landfill Barriers

von Mu, Q. Y.
Veröffentlicht in ICEG (8. : 2018 : Hangzhou) Proceedings of the 8th International Congress on Environmental Geotechnics ; Volume 2 (2019)

The Waffle Substrate: A Novel Approach to Reducing Substrate Resistance in SiC Power Devices

von Opondo, N.
Veröffentlicht in International Conference on Silicon Carbide and Related Materials (18. : 2019 : Kyōto) Silicon carbide and related materials 2019 (2020)