Low Melting Temperature Solder Interconnect Behavior and Thermal Cycling Performance Enhancement Using Edgebond

von Lee, Tae-Kyu
Veröffentlicht in SMTA International Conference (2020 : Online) SMTA International Conference 2020 (2021)

Fundamentals of lead-free solder interconnect technology : from microstructures to reliability

Veröffentlicht 2015

LTS 575: Solder Joint Separation During Second Reflow Induced by VIPPO Structures: Mechanism and Modeling Methodology Study

von Xie, Weidong
Veröffentlicht in SMTA International Conference (2021 : Minneapolis, Minn.; Online) 2021 SMTA International Conference ; Volume 2 of 2 (2022)

Multi-axis Loading Effect on Edgebond and Edgefilled WLCSP Thermal Cycling Performance

von Lee, Tae-Kyu
Veröffentlicht in SMTA International Conference (2019 : Rosemont, Ill.) SMTA International Conference 2019 ; Volume 1 of 2 (2020)