Special issue on "recent progress of science & technologies in thermophysical properties of molten slag and metals at high temperatures" : [papers presented at the 10th Asian The...

Veröffentlicht 2014

Familial Guilt: A Cross-Society Comparison of Judgments of Collective Family Responsibility

von Lee, Junho
Veröffentlicht in Cognitive Science Society (44. : 2022 : Toronto; Online) Cognitive diversity ; Volume 3 of 6 (2023)

Effect of Keying Flaps on a Multiline Ring Anchor in Soft Clay

von Lee, Junho
Veröffentlicht in IFCEE (4. : 2021 : Dallas, Tex.) IFCEE 2021 ; 1: Installation, testing, and analysis of deep foundations (2021)

Implementation of Pixel Technology for Automotive Lighting System based on Wafer-Level Process

von Lee, Jonghun
Veröffentlicht in International Symposium on Automotive Lighting (13. : 2019 : Darmstadt) Proceedings of the 13th International Symposium on Automotive Lightning (2019)

Control of Wheeled-Legged Quadrupeds Using Deep Reinforcement Learning

von Lee, Joonho
Veröffentlicht in International Conference on Climbing and Walking Robots and Mobile Machines Support Technologies (25. : 2022 : Sao Miguel) Robotics in natural settings (2023)

Promoting Pro-Climate Actions: A Cognitive-Constraints Approach

von Lee, Junho
Veröffentlicht in Cognitive Science Society (42. : 2020 : Online) Developing a mind: learning in humans, animals, and machines ; Volume 3 of 5 (2020)

Analyst reputation and management earnings forecasts

von Kim, Jae Bum
Veröffentlicht in Journal of accounting and public policy (2021)

Disgraced Professionals: Revelation of Immorality Decreases Evaluations of Professionals’ Competence and Contribution

von Lee, Junho
Veröffentlicht in Cognitive Science Society (43. : 2021 : Online) Comparative cognition - animal minds ; Volume 3 of 5 (2021)

A Survey of Wheeled-Legged Robots

von Bjelonic, Marko
Veröffentlicht in International Conference on Climbing and Walking Robots and Mobile Machines Support Technologies (25. : 2022 : Sao Miguel) Robotics in natural settings (2023)

GRIP: Graph Representation of Immune Repertoire Using Graph Neural Network and Transformer

von Lee, Yongju
Veröffentlicht in AAAI Conference on Artificial Intelligence (37. : 2023 : Washington, DC; Online) 37th AAAI Conference on Artificial Intelligence (AAAI-23) ; Volume 4, part 2 of 2 (2023)

Emotion Evaluator: Expanding the Affective Lexicon with Neural Network Model

von Lee, Junho
Veröffentlicht in Cognitive Science Society (44. : 2022 : Toronto; Online) Cognitive diversity ; Volume 3 of 6 (2023)

SWOT-AHP analysis of the Korean satellite and space industry : strategy recommendations for development

von Lee, Junho
Veröffentlicht in Technological forecasting & social change (2021)

Cost Analysis of Multiline Ring Anchor System for Offshore Wind Farm

von Lee, Junho
Veröffentlicht in DFI Annual Conference on Deep Foundations (45. : 2020 : Online) People, purpose, passion (2021)

The liability of foreignness in international equity investments : evidence from the US stock market

Veröffentlicht in Journal of international business studies (2013)

Dynamic management of adaptor threads for supporting scalable RFID middleware

von Park, Chungkyu
Veröffentlicht in Dynamics in Logistics (2011)

Dynamic management of adaptor threads for supporting scalable RFID middleware

Veröffentlicht in Dynamics in logistics (2011)

Effect of Wing Plates on Vertical Load Capacity of a Multiline Ring Anchor System in Clay

von Lee, Junho
Veröffentlicht in Geo-Congress (2022 : Charlotte, NC) Geo-Congress 2021 ; 2: Deep foundations, earth retention, and underground construction (2022)

TSV Mutual Inductance Effect on Impedance of 3D Stacked On-Chip PDN with Multi-TSV Connections

von Pak, Jun So
Veröffentlicht in 2010 IEEE CPMT Symposium Japan (2010)

Uplift Resistance of a Multiline Ring Anchor System in Soft Clay to Pad Extreme Conditions

von Lee, Junho
Veröffentlicht in Geo-Extreme Conference (2021 : Savannah, Ga.) Geo-Extreme 2021 ; 1: Case histories and best practices (2021)

Modeling and Analysis of Differential Signal Through Silicon Via (TSV) in 3D IC

von Kim, Joohee
Veröffentlicht in 2010 IEEE CPMT Symposium Japan (2010)