Edge Bonding Voids Management Using Humid Helium Bonding Atmosphere

von Fournel, F.
Veröffentlicht in International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17 (2023)

Impact of an Amino-Alcohol Organic Molecule on SiO2 and Si Bonding Energy

von Fournel, F.
Veröffentlicht in Pacific Rim Meeting on Electrochemical and Solid State Science (2020 : Online) (16.) Semiconductor Wafer Bonding: Science, Technology and Applications 16 (2020)

Infrared Spectroscopy Study of Edge Water Penetration at Hydrophilic Bonding Interface

von Noël, P.
Veröffentlicht in International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17 (2023)

Nanosecond Laser Irradiation for Interface Bonding Characterization

von Larrey, V.
Veröffentlicht in International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17 (2023)